|
|
 |
 |
| HOME > Product> PRINTED ELECTRONICS> CONDUCTIVE SILVER INKS |
  |
| |
|
|
|
|
TEC is the acronym for ¡°Transparent Electronic Conductive,¡± and one of the salient features of that TEC ink is that it is purely transparent in the liquid form before firing. TEC ink is unique because it is not formulated by particle structure.
Silver TEC ink is stable even in long-term storage and can be applied to various substrates because it makes ink firing in low temperatures for conductive traces.
|

|
Advanced manufacturing method
: Soluble Silver Cluster & Complex type
Reduction of the raw materials(Ag)
: Forms the thin layer compared to the others
Low temperature firing (Less than 120¡ÆC)
: Applicable to heat-weak substrates
Thin film & High Conductivity after short firing time
High stability and long-term storage
|
|
| |
| Types of TEC
Inks |
|
|
 |
 |
| Printing Process |
Inkjet |
Screen(Rotary/Flat) |
Spray/Dipping |
Gravure/Flexo/Offset |
|
 |
| Layer Thickness |
(Depending on dpi)
150nm ~ 1.5 |
0.5 ~ 2 |
~ 250nm |
50nm ~ 3 |
|
 |
| Viscosity |
3 ~ 15cps |
3,000 ~ 100,000 cps |
3 ~ 15cps |
5 ~ 500cps |
|
 |
| Firing Temp |
130 ~ 350 |
120 ~ 560 |
120 ~ 150 |
120 ~ 170 |
|
 |
Volume Resistivity
( cm) |
2.5x10 ~ 4.2x10 |
3.0x10 ~ 6.0x10 |
6.0x10 |
6.0x10 |
|
 |
|
| |
| |
 |
| |
|
|
 |
 |
 |
| InkTec Conductive Nano Silver Paste Ink, developed with our original technology, is a new Hybrid Type conductive nano paste. It shows good conductivity and high adhesiveness for various substrates after short-term sintering. These aspects make the nano silver paste particularly useful for a wide range of electronic products. |
 |
 |
| Viscosity(cps) |
7,000~7,500 |
33,000~38,000 |
110,000~112,000 |
|
 |
| Metal Contents |
55wt.% |
55±2wt.% |
62±2wt.% |
|
 |
| Sintering Temperature |
140 (5min) |
250~300 (30min) |
550 (30min) |
|
 |
| Printing Layer Thickness |
<1~2§ |
<2~3§ |
<2~3§ |
|
 |
| Sheet Resistivity |
40~50m§Ù/sq. |
13.3m§Ù/sq. |
13.3m§Ù/sq. |
|
 |
| Volume Resistivity (§Ùcm) |
<4.0¥¹10 |
<4.0¥¹10 |
<4.0¥¹10 |
|
 |
| Substrates |
PET, PI, PP etc. |
PI, Glass etc. |
Glass etc. |
|
 |
| Flake particle based ink (For Touch Panel, Thin film solar cell and so on)
|
 |
 |
| Viscosity(cps) |
50,000
~60,000 |
160,000
~200,000 |
160,000
~200,000 |
160,000
~200,000 |
160,000
~200,000 |
|
 |
| Metal Contents |
70±2wt.% |
73.5±2wt.% |
70±2wt.% |
70±2wt.% |
74.5wt% |
|
 |
| Sintering Temperature |
130 (20min) |
130 (20min) |
130 (20min) |
130 (20min) |
130 (20min) |
|
 |
| Printing Layer Thickness |
<2~3§ |
<2~3§ |
<2~3§ |
<2~3§ |
<2~3§ |
|
 |
| Sheet Resistivity |
18.4m§Ù/sq. |
18.6m§Ù/sq. |
23.2m§Ù/sq. |
23.2m§Ù/sq. |
80m§Ù/sq. |
|
 |
| Volume Resistivity (§Ùcm) |
4.6 X 10 |
4.66 X 10 |
5.8 X 10 |
5.8 X 10 |
8 X 10 |
|
 |
| Minimum line width |
100§ ↑ |
90~100§ |
70~80§ |
50~60§ |
50~60§ |
|
 |
| Substrates |
ITO Film,
Glass |
ITO Film,
Glass |
ITO Film,
Glass |
ITO Film,
Glass |
ITO Film,
Glass |
|
 |
|
| Comparison SEM images with other paste ink |
| Surface |
|
Cross section |
 |
|
 |
|
 |
|
 |
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
|
| |
|
|
|